Polymeric sidewall transfer lithography

Abstract This work is to demonstrate a low cost and time-conserving technique create nano-trenches by transferring nano-scale polymeric sidewalls into substrate. The sidewall vertically spreading layer deposited spin-coating polymer solution on vertical template. By varying processing parameters such as the concentration or speed, dimension of can be changed, which, after pattern transfer, also changes nano-trench dimension. In this work, high-resolution trenches about 15 nm have been achieved straight line Other than patterns, method fabricates ring-shaped patterns including circles, squares, concentric squares. With various shapes has potential implement other practical applications fabricating nanoimprint molds nm.